Portable rugged design.
Pressurized tank integrated into gun.
Precise PID thermal control.
Designed specifically for PA adhesives.
Light weight aluminum material.
Easy loading design.
Compact storage.
Application
Our machines are engineered for low pressure molding applications. Using specialty resins to encapsulate delicate parts.
Applications including : automotive electronics, PCBA，coil, fiber-optic, LED lighting, wire, cable, etc.
Specification
Machine Size / Weight | 21.26 in x 15.75 in x 20.08 in / 41.9 lbs |
Gun Weight | 2.7 kg | 6.0 lbs |
Footprint | 21.26 in x 15.75 in |
Working Station Height | N/A |
Packing Size / Weight | 24.02 in x 17.32 in x 18.31 in / 44.1 lbs |
Melting Tank Model & Q'ty | MT-0.3-100 |
Auto Feeding System | N/A |
Gun Model & Tip | LPMS-G01 x 1 / 36.4° |
Heated Hose Model & Q'ty | N/A |
Electricity | 200-240VAC / 1 Phase/ 50Hz |
Temperature Control Zones | 1 |
Temperature Range | Ambient up to 250°C / 485°F |
Max .Power | 0.5 Kw |
Min. Air Pressure | 0.5MPa | 73 Psi |
Air Consumption | 0.05 m3 / min | 1.77 ft3 / min |
Clamping | N/A |
Clamping Force | N/A |
Clamping Stroke | N/A |
Control System | Temp controller, Air pressure regulator, Time relay |
Safety Protection | N/A |
Mold Set Size | 3.94 in x 3.15 in x 2.36 in / 8.16 lbs (Steel),2.65 lbs (Aluminum) |
Max . Mold Set Size | 9.05 in x 5.91 in x3.15 in |
Max . Part Size | 0.79 in x 0.79 in x 0.20 in |
Dimension
Video
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